DESIGNERCOUNCIL Archives

June 1999

DesignerCouncil@IPC.ORG

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DesignerCouncil <[log in to unmask]>
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Mon, 14 Jun 1999 08:37:41 -0500
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"DesignerCouncil E-Mail Forum." <[log in to unmask]>, Mark Love <[log in to unmask]>
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Mark Love <[log in to unmask]>
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Doug,

We are in the first stages of a design which requires vias in a SMD pad for heat sink purposes. They will
be blind vias going from the top layer to the ground plane right below it on a 4 layer board
(signal,plane,plane,signal). The part is a class d stereo audio power amp and it's heat sink is a pad on
the belly of the IC and the vias will transfer heat to the ground plane.

Mark Love
PCB Designer
Oxmoor Corporation
2111 Parkway Office Circle
Birmingham, AL 35244
205-985-7040
205-985-9966 fax
[log in to unmask]
http://www.oxmoor.com


Doug wrote:

> Would someone please be kind enough to explain what
> design criteria would require holes in SMD pads?
>
> Especially blind holes in SMD pads?
>
> TIA,  Doug McKean
>
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