DESIGNERCOUNCIL Archives

June 1999

DesignerCouncil@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Sender:
DesignerCouncil <[log in to unmask]>
Date:
Fri, 11 Jun 1999 16:21:22 -0700
Reply-To:
[log in to unmask]
Subject:
Re: Via Holes Within SMD Pads ...
From:
Mitch Morey <[log in to unmask]>
X-cc:
Doug <[log in to unmask]>
Content-Type:
multipart/alternative; boundary="------------7D4A926A2532512F0EA323E4"
Organization:
NSI Communications
MIME-Version:
1.0
Parts/Attachments:
text/plain (925 bytes) , text/html (1025 bytes)

ATOM RSS1 RSS2