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May 1999

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Subject:
From:
WILLIAM EDELMAN <[log in to unmask]>
Reply To:
WILLIAM EDELMAN <[log in to unmask]>
Date:
Fri, 7 May 1999 13:06:13 -0400
Content-Type:
multipart/mixed
Parts/Attachments:
We produce an ultrasonic soldering system, the G35. The system has unique
capabilities to solder without flux, attach dissimilar metals, attach metals
to glass, ceramic, etc. Please see our website www.fibrasonics.com for more
information, or contact us and our application engineers will be happy to
assist you.

**********************************
**********************************



WILLIAM EDELMAN
President, Fibra Sonics, Inc.



IN BOSTON:


2 MANN'S HILL CRESCENT
SHARON, MA 02067-2267
(781) 793-0357 OFFICE
(781) 784-2146 FACSIMILE
(781) 784-3431 HOME
[log in to unmask]


IN CHICAGO:


FIBRA SONICS, INC.
5312 NORTH ELSTON AVENUE
CHICAGO, IL 60630
(773) 286-7377 OFFICE
(773) 286-8147 FACSIMILE
www.fibrasonics.com


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-----Original Message-----
From: Kathy Palumbo <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Date: Friday, May 07, 1999 12:54 PM
Subject: Re: [TN] (Fwd) Ultrasonic soldering


>Pat,
>
>A couple of years ago I used an Ultra-Sonic solder for static solder dip.
>The solder pot was by Black Stone Ultra-Sonics.  It had a foot peddle you
>pushed, which activated the Ultra-Sonics.  It was very effective.  I was
>having a major problem with the leads on some PGA substrates.  They were
>KOVAR leads and the nickel plating over the KOVAR lead had spots where the
>plating was very thin (less than 100u inches, or non-existent).  The iron
in
>the KOVAR lead was leaching through the nickel plating leaving black spots
>which were unsolderable.  Since the substrates were expensive and the
>supplier would not accept responsibility for their defective parts we had
no
>choice, but to try and rework them.  I stripped all the Lead/Tin plate off
>the leads.  Soaked the leads in Nickel-Nu.  Replated the leads with Nickel,
>and Ultra Sonically solder dipped the leads.    In some cases I was able to
>perform the tinning process with no flux.  The rework process was very
>successful (75% of the substrates were salvaged), and I believe the high
>success rate was partly due to the ultra sonic solder pot.
>
>If you're having an issue with unsolderable surfaces, and the product can
>with stand Ultra-Sonics, an Ultra-Sonic solder pot comes in very handy.
>
>Sincerely,
>Kathy Palumbo
>Manufacturing Engineer
>Viking Components, Inc.
>
>
>
>
>> -----Original Message-----
>> From: PAT DIAMOND [SMTP:[log in to unmask]]
>> Sent: Friday, May 07, 1999 1:23 AM
>> To:   [log in to unmask]
>> Subject:      [TN] (Fwd) Ultrasonic soldering
>>
>> Forwarded message:
>> From:     Self <SWFN01/PDIAMOND>
>> To: [log in to unmask]
>> Subject: Ultrasonic soldering
>> Reply-to: [log in to unmask]
>> Date: Fri, 7 May 1999 08:15:42 EMT+0
>>
>> Hello all,
>>
>> I have just been reading an article on Ultrasonic soldering
>> which looks interesting, has anyone out there had had any
>> experience of this process?
>>
>> Thanks,
>>
>> Pat Diamond
>> Weston Aerospace
>> Pat Diamond
>> Senior Manufacturing Engineer
>> Weston Aerospace
>> Farnborough
>> Hampshire
>> GU14 7PW
>>
>> Tel 01252 544433
>>
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