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May 1999

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Subject:
Re: PBGA reliability modeling
From:
Werner Engelmaier <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Sat, 29 May 1999 17:27:07 EDT
Content-Type:
text/plain
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text/plain (21 lines) 
Hi Yuan,
This increase is possible only if the thickness increase substantially
reduces the warpage of the PBGA or substantially decouples the influence of
the die on the global expansion mismatch. It still sounds too large, though.
To say something more, I need the full details of your analysis and some of
the result details.

Werner Engelmaier

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