Electronics Assembly Process Exhibition and Conference (APEXsm)
CALL FOR PARTICIPATION
March 12-16, 2000
Long Beach Convention Center
Long Beach, CA
Developed by the industry for the industry, the APEX conference provides significant
visibility for you and your company on your research work. Your participation
contributes to the advancement of our industry and enhances your professional
reputation. Distribution of the conference proceedings to over 1500 companies and
individuals will help ensure that your published paper is seen by key engineers and
managers throughout the electronics assembly industry.
How You Can Participate
--Chair a Technical Session
Act as chairperson and organize a technical session of five to six speakers from
different companies speaking on various areas of a common theme. Presentations should
be geared to an audience involved in electronic manufacturing and be non-commercial.
Individuals interested in organizing a technical session should submit a proposed
session topic and tentative speaker names by June 1, 1999.
--Present a Paper
Be a speaker at one of the technical sessions. Paper should illustrate how well
established or newly-developed electronic assembly technology is being successfully
applied. This requires the submission of a single page abstract of original and
unpublished work, covering case histories, research or discoveries. The abstract
should summarize the problem, the methods used and results of the experiments. Since
the selection process is competitive, sufficient detail should be included in the
abstract to allow the Technical Program Committee to assess the technical content of
the proposed paper. Abstracts must be received by July 15, 1999.
The paper should be 6 to 12 pages in length (text and graphics), and should describe
significant results from experiments, emphasize new techniques, discuss trends of
interest, and contain technical and/or appropriate test data. Papers focused on a
company's product, rather than the technology, are not permitted. All presentations
require publication of a paper in the conference proceedings and should comply with
IPC publication guidelines. Papers must be received by December 15, 1999.
--Win a $1,000 Award
To reward exceptional achievement, two awards are available to speakers - the Best
Conference Paper award for U.S. authors and the Best International Paper for foreign
authors. Each award is for $1,000 and a recognition plaque. Co-authors share the cash
award and receive a recognition plaque.
--Organize a Panel Discussion or Forum
Act as moderator of a panel discussion or forum and recruit 4 to 5 speakers from
different companies to debate a specific technical or industry issue for
approximately one hour. Individual interested in organizing a panel discussion or
forum should submit a proposed topic and tentative speaker names by July 15, 1999.
--Teach a Workshop or Tutorial
Present a half-day (3-hour) workshop or full-day (6-hour) or two-day tutorial (12
hours) to a class of up to 50 persons. Selected topics should relate to the
electronic assembly technology. Proposals with a course description must be submitted
by July 1, 1999. A master copy of the course workbook, complying to the IPC published
guidelines, must be submitted no later than December 15, 1999. An honorarium is
offered to workshop and tutorial instructors.
--Benefits of Participating
As a conference participant you will be entitled to discounts on educational courses,
a free single-day pass to the Technical Sessions, free attendance to keynote speakers
and forums, a copy of the Proceedings, complimentary admission to the Exhibits &
Reception on the show floor, and the Gala Reception & Concert.
Abstracts and course proposals are sought in the following areas:
DESIGN FOR MANUFACTURE
--Tools
--Standards
--Concurrent Engineering
--Manufacturing Software
--MRP Systems
--Case Studies: Implementing New Technologies
--Pad Design & Geometry
MATERIALS
--Flux/Solder Paste
--Underfills
--Lead Free Solders
--Protective Coatings
--Conductive Adhesives
--Flex Circuits
--Solder/Solderability
--Surface/Lead Finishes
DEVELOPMENTS IN PASSIVE TECHNOLOGIES
--Embedded Components
--Shields/Shielding
--Connectors
--HDI Boards
--Improving Portable Battery Life
AREA ARRAY ASSEMBLY PROCESSES
--Solder Paste Printing
--Ball Grid Array/Chip Scale Packaging (BGA/CSP)
--Direct Chip Attach/Chip-On-Board (DCA/COB)
--Flip Chip on Flex (COF)
--Adhesive Dispensing
--Flexible Manufacturing (zero setup)
--Cleaning/No-Clean
--Temperature Profiling
--Yield Prediction & Analysis
--Bare/Bumped Dies
--New Assembly Technologies
--Testing Strategies/Issues
--Intrusive Reflow
--Defect Detection Techniques
--Board-Level Reliability
ASSEMBLY EQUIPMENT ADVANCES
--SMT/Thru-Hole Equipment
--Manufacturing Systems
--Factory Automation
--Robotics
--High Speed Placement/Feeders
--Stencils/Printing
--Soldering Systems
--Dispensing
--X-Ray/Optical Inspection
--Test Probes/Test Fixturing
--Rework & Repair
--Equipment Selection Criteria
--Odd Form Placement
ELECTRONICS MANUFACTURING SERVICES
--Market trends
--Establishing Partnerships
--Introducing New Technologies
--Cycle time Reduction
--Global Manufacturing Strategies
--New Product Introduction
--Technology Transfer
--Cost Identification & Control
--Training Employees (Computer-based Training)
--Build-to-Order Methodology (BTO)
--Outsourcing Selection Criteria
--Real-time Customer Order Status
ENVIRONMENTAL CONCERNS
--Leadfree Solder Status
--ISO 14000
QUALITY
--Measurement of Customer Satisfaction
--Malcolm Baldrige Quality Award Lessons
--Supplier Validation Methodology
--Continuous Improvement/Benchmarking
--Managing Change
--Failure Analysis Techniques
FUTURISTIC TECHNOLOGY - BEYOND 2000
--Displays
--Fiber Optics
--Bio Sensors
--Information Technology
Please submit abstract and a brief biography to:
Martin Barton, Conference Director, email address: [log in to unmask]
* fax/phone: (972) 424-8805.
For more information visit our web site: www.ipc.org/html/apex.htm or call toll-free
1-877-472-4724. For information on exhibiting call (847) 790-5386.
-- SUBMISSION DATES:
--Abstracts: July 15
--Acceptance: August 15
--Manuscripts: December 15
--Tutorial/Workshop Proposals: July 1
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