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May 1999

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Subject:
From:
"Meigs, Jonathan" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum." <[log in to unmask]>, "Meigs, Jonathan" <[log in to unmask]>
Date:
Wed, 26 May 1999 11:52:43 -0700
Content-Type:
text/plain
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text/plain (66 lines)
Thanks for the replies, and the reminder to be specific.
I would much prefer to immerse the samples for etching (they are about 3" by
5").

If necessary, I could build a small spray etcher, I suppose, but maintaining
temperature of a small volume of etchant recirculating after spray might be
a challenge.

Any recommendations are most welcome, and again thank you for the advice.

-----Original Message-----
From: Dennis Fritz [mailto:[log in to unmask]]
Sent: Wednesday, May 26, 1999 12:29 PM
To: [log in to unmask]
Subject: Re: [TN] Ammoniacal Etchant Recipe


The common ammoniacal etchants in printed circuit production  are similar to
the fomula given from Phibrotech.  However, all depend on air oxidation of
etched copper in solution from the circuit boards.  They will not work by
immersion.   If an immersion ammoniacal etchant is desired, a supplemental
oxidizer must be added.   These are the "ammoniacal etchants" used to remove
the copper from steel parts that are copper plated to pass thru a heat treat
oven without oxidizing the surface of the steel.   Is spray or immersion
ammoniacal needed?

Denny Fritz
MacDermid, Inc.

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