Hi Rich!
There are many variations of the copper-oxide treatmant that enhance adhesion
between prepreg and copper conductor pattern.
However,the copper-oxide treatment is very soluble in acids. If the prepreg-copper
interface is damaged during drilling,the dark copper-oxide will dissolve during
the plating process,leaving a distinct "Pink Ring" around holes.
One way to prevent pink ring problems is to use a copper-oxide reduction step
after copper oxide formation.
The world wide market of the reducer solution containing amine borane compounds
is the following.
          '92     '95      '96     '98      '00(forecast)
M$/year    2.5     11       15      21       25-30

Regards,
Motoyo Wajima
Enterprise Server Division,Hitachi,Ltd.(Japan)




[log in to unmask]  $B$5$s$O=q$-$^$7$? (B:
>In producing multilayer PCB's, there is an oxide process used to prevent pink
>ring.  Usually this process is called the "black oxide process" and requires use
>of a reducer solution containing an amine borane.
>
>Is this process considered a standard in the PCB industry and is it's use
>increasing?
>
>Are there alternative processes which accomplish the same objective?
>
>What is the future trend to eliminate pink ring?
>
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***********************************************
Motoyo Wajima
Enterprise Server Division,Hitachi,Ltd.
1 Horiyamashita
Hadano-shi,Kanagawa-ken,259-13 Japan
E-mail:[log in to unmask]
Fax:+81-463-88-2935
***********************************************

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Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################