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May 1999

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Subject:
From:
"Kane, Joseph" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 26 May 1999 11:15:49 -0400
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In the May 24 issue of Electronic News, an article titled "IPC Drawing
Lead-Free Roadmap":

" 'As Europe decides whether to adopt a resolution to eliminate lead in
electronics assemblies by 2004, IPC - Association Connecting Electronics
Industries is taking a lead role in encouraging the development of lead-free
electronics assemblies by creating a roadmap to create useful alternatives,'
the trade association said."

And this:

"Resistance to the creation of a lead-free electronics assembly roadmap is
minimal according to (Dave) Bergman."

> ----------
> From:         Stephen R. Gregory[SMTP:[log in to unmask]]
> Reply To:     TechNet E-Mail Forum.;[log in to unmask]
> Sent:         Tuesday, May 25, 1999 12:58 PM
> To:   [log in to unmask]
> Subject:      Re: [TN] Lead free road map for U.S.?
> 
> In a message dated 5/25/99 8:22:18 AM Pacific Daylight Time, 
> [log in to unmask] writes:
> 
> << Sorry but if our Electronic Times is telling the truth the IPC is
>  intending to encourage lead free products in the U.S. along with Europe.
>  It appears the requests for the IPC to oppose the European legislation
>  have brought the whole thing about.
>  Looks like we might all be ending up with the lead problem. I wonder
>  what the new definition for solder will be in a few years time.
>  --
>  Roger M Unwin
>  P+M Services (R) Ltd. Tel: 01706 815212  Fax: 01706 818636
>  Http://www.p-m-services.demon.co.uk >>
> 
> Hi Roger!
> 
> You've started-up once again one of my favorite (?) topics. But I don't
> think 
> what you've read is quite correct...that is unless things have change 
> drastically in the last few weeks. While not attempting to speak directly
> for 
> the IPC, I do have the May 1999 copy of the magazine "IPC Review" and it 
> contains a very good article about the push for Lead-free, and the forum
> that 
> was held at the IPC Printed Circuits Expo '99; "Getting the Lead Out of 
> Electronics: Is it Feasible, or Even Warranted?" The subtitle of the
> article 
> is; "Tension over lead is building again. But is the cure more painful
> than 
> the disease?" Doesn't sound something one would publish if they're ready
> to 
> roll over and push for lead free does it?
> 
> A few salient points from the article:
> 
> "Even before the forum began, a straw poll of about 100 PWB executives 
> meeting in another corner of the Expo indicated that 70 to 80 percent of
> the 
> boards they build are produced with hot air solder leveling. Lead based 
> solders have been the one constant in assembly for decades. And how many 
> components have no-lead leads?"
> 
> "The forum itself was a potpourri of data. A four year, $10 million study 
> funded by several major US OEMs and the National Institute of Standards
> and 
> Technology and conducted under the auspices of the National Center for 
> Manufacturing Sciences found that, among 79 alloys researched, only three 
> were suitable as lead alternatives, and none were drop-in replacements."
> 
> "In research begun as part of a U.K consortium in 1992, 200 solder alloys 
> were evaluated, with seven ultimately selected for trials, and two - 
> tin/copper and tin/silver - settled on for detailed analysis on
> performance, 
> cost and availability. These alloys were tested with various component and
> 
> PWB finishes. Consortium members Nortel Networks and Cemco explained that 
> temperatures of tin/copper HASL are uniformly higher than tin/lead; for 
> example, air knife and bath temperatures of the former are 280° C. And
> pull 
> strength tests showed tin/copper to be slightly weaker than tin/lead, 
> although it did do better in multiple pass reflow and high humidity aging 
> tests run with gold over nickel finishes."
> 
> And the final point of the article that I like:
>
> "With the scientific merits at best ambiguous, the price of a lead-free 
> electronics world is high."
> 
> 
> -Steve Gregory-
> 
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