The following is provided by Dave Nicol (Lucent Technologies), chair of  IPC's
committee that developed the 9500 series documents.  Dave is also an active member of
the joint working group that developed J-STD-020 and 033.

J-STD-020 and J-STD-033 are topic specific replacements for IPC-SM-786A. They were
developed as a joint effort by IPC and JEDEC to address many of the concerns of both
manufacturers and users. IPC-SM-786A did not take into account many of the material
advances and improved procedures that are now available for use.

Following is a brief description of all the documents that involve classification and
qualification. (There is a difference!)

J-STD-020A Moisture/Reflow Sensitivity Classification For Non-Hermetic Solid State
Surface Mount Devices  This document covers the classification of moisture sensitive
ICs (Defining levels 1-6). Primarily suppliers will use the test methods in
J-STD-020A. Like any material qualification document, users will need to be familiar
with the document to understand what the different levels signify.

J-STD-033 Standard for Handling, Packing, Shipping and Use of Moisture/Reflow
Sensitive Surface Mount Devices  This document describes the proper handling and
packaging of IC's classified by J-STD-020A. J-STD-033 will be used by both suppliers
and users of moisture sensitive IC's.

IPC-9501 PWB Assembly Process Simulation for Evaluation of Electronic Components
(Preconditioning IC Components)  This is a qualification procedure used to evaluate
components for various assembly processes ( currently under revision for IC's only
reflow and wave)

IPC-9502 PWB Assembly Soldering Process Guideline For Non-IC Electronic Components
This document provides the assembler process limits that components qualified to the
above conditions can be expected to pass

IPC-9503 Moisture Sensitivity Classification for Non-IC Components  This
classification document is identical to J-STD-020A except that it is used for non-ICs
(no size exceptions granted)

IPC-9504 Assembly Process Simulation for  Evaluation of Non-IC Components
(Preconditioning Non-IC Components)  This is a qualification procedure used to
evaluate Non ICs for various assembly processes.

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