Subject: | |
From: | |
Reply To: | TechNet E-Mail Forum. |
Date: | Fri, 21 May 1999 15:24:28 -0400 |
Content-Type: | text/plain |
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Warp depends on:
- how close the board gets to its Tg during the reflow cycle (the closer
you get to the Tg the worse the warp gets)
- the amount of copper on each side and the balance between the two
- thickness of the board
- overall length x width
- time under temperature
- rate of cool down
Mutiple thermal cycles - such as rework - are never a good thing.
My best suggestion - get the copper balanced and if possible go to higher
Tg materials.
Ted
----------
> From: Tempea, Ioan <[log in to unmask]>
> To: [log in to unmask]
> Subject: [TN] PCB specs
> Date: Friday, May 21, 1999 1:58 PM
>
> Hi PCB fabs,
>
> this one's for you.
>
> I'm caught into a lot of fussing about whether my reflowing profiles warp
> the boards or not.
>
> What I'd like to know is if the PCB manufacturers recommend optimal
reflow
> profiles for their boards or, at least, two things:
>
> 1. maximum temperatures the boards can withstand without warping or
getting
> damaged in any way
> 2. maximum number of thermal cycles the board can take, including double
> reflow, waving and some rework
>
> I don't mind if I hear from PCB users either.
>
> Have a good week-end after answering, Ioan
>
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