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May 1999

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Subject:
From:
"Tempea, Ioan" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum." <[log in to unmask]>, "Tempea, Ioan" <[log in to unmask]>
Date:
Fri, 21 May 1999 13:58:48 -0400
Content-Type:
text/plain
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text/plain (42 lines)
Hi PCB fabs,

this one's for you.

I'm caught into a lot of fussing about whether my reflowing profiles warp
the boards or not.

What I'd like to know is if the PCB manufacturers recommend optimal reflow
profiles for their boards or, at least, two things:

1. maximum temperatures the boards can withstand without warping or getting
damaged in any way
2. maximum number of thermal cycles the board can take, including double
reflow, waving and some rework

I don't mind if I hear from PCB users either.

Have a good week-end after answering,         Ioan

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