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May 1999

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Subject:
Re: BGA soldering specs.
From:
Andy Mackie <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 6 May 1999 08:40:00 -0400
Content-Type:
text/plain
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text/plain (24 lines) 
Steve: Thanks for your explanation of IPC's activities on BGA voiding. Just
two 'small' questions (maybe 'big' answers??):

i./ Is that 20-30% by cross-sectional area, or volume, or what?

ii./ Is there any comment also about WHERE the voids are located -
solder/UBM or solder/pad?

Ta,

Andy

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