We use a medium deposit thickness.  About 65 microinches.

-----Original Message-----
From: Mcmaster, Michael [mailto:[log in to unmask]]
Sent: Thursday, May 20, 1999 12:00 PM
To: [log in to unmask]
Subject:


Mike

What type of electroless do you use?  With Low-build electroless, I'd be
concerned with handling the board.

If the boards are already plated, I've had some success drilling a
non-plated hole at the leading edge (relative to the router program) of
the castellation.  The motion and rotation of the router bit tends to
pull  the copper away on this side.  It doesn't necessarily eliminate
burring and slivers but it does cut down on them.



> ----------
> From:         Mike Bailey[SMTP:[log in to unmask]]
> Reply To:     TechNet E-Mail Forum.;Mike Bailey
> Sent:         Wednesday, May 19, 1999 1:22 PM
> To:   [log in to unmask]
>
> You can perform a routing operation after electroless copper in the
> affected
> area and then process as normal.  The electroless deposit will
> generally not
> be prone to deformation.
>
> -----Original Message-----
> From: Ted Wiktorowicz [mailto:[log in to unmask]]
> Sent: Wednesday, May 19, 1999 12:51 PM
> To: [log in to unmask]
> Subject:
>
>
> To anyone who can help
>
> I have a design that requires Castelated Via's (via's that have their
> centres lie on the edge of a board, where after a machining operation
> only
> half of the via is left exposed).
>
> The via's are 0.025" @ 0.100" centres with a total of 17 via's.
>
> I would like to know if anyone knows of a functional process that will
> not
> damage or push in the barrel of the hole or leave slivers after the
> process
> is completed.
>
> Your help is appreciated.
>
> Ted
>
>

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