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May 1999

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Subject:
From:
Mike Bailey <[log in to unmask]>
Reply To:
"TechNet E-Mail Forum." <[log in to unmask]>, Mike Bailey" <[log in to unmask]>
Date:
Wed, 19 May 1999 13:22:49 -0700
Content-Type:
text/plain
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text/plain (64 lines)
You can perform a routing operation after electroless copper in the affected
area and then process as normal.  The electroless deposit will generally not
be prone to deformation.

-----Original Message-----
From: Ted Wiktorowicz [mailto:[log in to unmask]]
Sent: Wednesday, May 19, 1999 12:51 PM
To: [log in to unmask]
Subject:


To anyone who can help

I have a design that requires Castelated Via's (via's that have their
centres lie on the edge of a board, where after a machining operation only
half of the via is left exposed).

The via's are 0.025" @ 0.100" centres with a total of 17 via's.

I would like to know if anyone knows of a functional process that will not
damage or push in the barrel of the hole or leave slivers after the process
is completed.

Your help is appreciated.

Ted

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