Michael:
As others have pointed out, annealing would generally increase grain
size and orientation. How much depends on time, temperature and
atmosphere.

If the process after copper deposition requires annealing (as in a
semiconductor wafer using copper), then annealing of your sample is
valid. If not, then don't. I cannot think of any reason why the SEM
analysis would require annealing. I think etching would be appropriate
to delineate the boundaries to make SEM work easier.

> Bill Davis, Ph.D.
> Diamond Multimedia Systems
> Senior Scientist
> Tel. 408.325.7868
> Cell. 408.888.5650
> e-mail: [log in to unmask]
>
>


-----Original Message-----
From: Alderete, Michael [mailto:[log in to unmask]]
Sent: Tuesday, May 18, 1999 3:21 PM
To: [log in to unmask]
Subject: Re: [TN] Copper grain size


Yasmeen-

I wonder if annealing might change the grain size (?). If it does,
wouldn't
this defeat the object of the analysis? [Any metallurgists out there who
could answer this?]

Michael Alderete


Yasmeen Nishath wrote...
------------------------------

Date:    Tue, 18 May 1999 15:16:53 -0500
From:    nishath yasmeen <[log in to unmask]>
Subject: Copper grain size

Hello, I want to measure grain size of plated copper on wafers. I have a
few questions about this.
Our SEM lab tech says that copper has to be annealed for this. Is it
necessary? If it is why is it done? What is the recommended time and
temperature?
Does the thickness of the deposit make a difference?
I appreciate any suggestions.
Thanks
Yasmeen

------------------------------

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