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May 1999

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Subject:
From:
David Pizzoferrato <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 18 May 1999 16:41:50 -0600
Content-Type:
text/plain
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text/plain (210 lines)
Sorry, but Uniplate does not utilize palladium. I have their literature and
it specifically states NO palladium....rather it uses a conductive polymer
(non metal).... However, that aside, what I am more interested in is
feedback, anecdotal or otherwise,  from those who have used it/ heard about
its pros/cons, know other who have used it, know of any other conductive
polymer process similar to Uniplate....

Dave

At 11:14 PM 5/18/99 +0100, Paul Brown wrote:
>The Uniplate process is a conductive polymer based on palladium as the final
>conductive layer
>The palladium is ionic and reduced to con the hole walls
>-----Original Message-----
>From: David Pizzoferrato <[log in to unmask]>
>To: [log in to unmask] <[log in to unmask]>
>Date: 18 May 1999 22:39
>Subject: Re: [TN] Conductive Polymer
>
>
>>No, I am not referring to screen printed conductive inks. What I am
>>referring is a replacement for electroless copper. A means by which to
>>sensitize the drilled hole wall in order to accept subsequent electroplate
>>copper. Specifically, conductive polymer process (Uniplate/Autotech) . Not
>>to be confused with carbon based "SHADOW" or "BLACK HOLE" technology.
>>
>>Regards
>>Dave
>>
>>
>>
>>At 10:07 PM 5/18/99 +0100, Paul Brown wrote:
>>>When you say conductive polymer do you mean screen printed conductive inks
>>>or palladium type processes
>>>at my last company we developed and installed a number of "direct plate
>>>installations " to replace electroless copper. This system was based on a
>>>reduced palladium conductive film, not a conductive organic layer
>>>Do you want more info
>>>Regards
>>>Paul Brown
>>>(UK 10pm,  raining and cold (8'C))
>>>-----Original Message-----
>>>From: Fred S. Shubert <[log in to unmask]>
>>>To: [log in to unmask] <[log in to unmask]>
>>>Date: 18 May 1999 21:50
>>>Subject: Re: [TN] Conductive Polymer
>>>
>>>
>>>>I would be very interested in reading this paper. Could you possibly
>>>compact
>>>>it and send it via e-mail? Or would you send it to me at:
>>>>
>>>>Fred Shubert
>>>>Kester Solder
>>>>2105 60th. Ave. Dr. E.
>>>>Bradenton, FL. 34203
>>>>
>>>>If that is not possible please let me know where I can obtain a copy.
>>>>
>>>>----- Original Message -----
>>>>From: Jason Smith <[log in to unmask]>
>>>>To: <[log in to unmask]>
>>>>Sent: Tuesday, May 18, 1999 3:08 PM
>>>>Subject: Re: [TN] Conductive Polymer
>>>>
>>>>
>>>>> I wrote such a paper along those lines, but it's too big (due to
>>>graphics)
>>>>to
>>>>> send over net.
>>>>>
>>>>>
>>>>>
>>>>> [log in to unmask] on 05/18/99 12:50:09 PM
>>>>>
>>>>> Please respond to [log in to unmask]; Please respond
>>>to
>>>>>       [log in to unmask]
>>>>>
>>>>> To:   [log in to unmask]
>>>>> cc:    (bcc: Jason Smith/Lex/Lexmark)
>>>>> Subject:  [TN] Conductive Polymer
>>>>>
>>>>>
>>>>>
>>>>>
>>>>> Hi all,
>>>>>
>>>>> I am looking for commentary (pro and con) on conductive polymer as a
>>>>> replacement for electroless copper. (not to be confused with carbon
>based
>>>>> technology i.e. Shadow, Black Hole etc.)
>>>>>
>>>>> More specifically I am looking for feedback on Uniplate. Reliability,
>>>>> process robustness, general acceptance by assemblers/customers, I
>>>>> appreciate all comments.
>>>>>
>>>>> Regards,
>>>>> Dave Pizzoferrato
>>>>>
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