TECHNET Archives

May 1999

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Re: Conductive Polymer
From:
Paul Brown <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 18 May 1999 23:14:26 +0100
Content-Type:
text/plain
Parts/Attachments:
text/plain (185 lines) 
The Uniplate process is a conductive polymer based on palladium as the final
conductive layer
The palladium is ionic and reduced to palladium on the hole walls
-----Original Message-----
From: David Pizzoferrato <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Date: 18 May 1999 22:39
Subject: Re: [TN] Conductive Polymer


>No, I am not referring to screen printed conductive inks. What I am
>referring is a replacement for electroless copper. A means by which to
>sensitize the drilled hole wall in order to accept subsequent electroplate
>copper. Specifically, conductive polymer process (Uniplate/Autotech) . Not
>to be confused with carbon based "SHADOW" or "BLACK HOLE" technology.
>
>Regards
>Dave
>
>
>
>At 10:07 PM 5/18/99 +0100, Paul Brown wrote:
>>When you say conductive polymer do you mean screen printed conductive inks
>>or palladium type processes
>>at my last company we developed and installed a number of "direct plate
>>installations " to replace electroless copper. This system was based on a
>>reduced palladium conductive film, not a conductive organic layer
>>Do you want more info
>>Regards
>>Paul Brown
>>(UK 10pm,  raining and cold (8'C))
>>-----Original Message-----
>>From: Fred S. Shubert <[log in to unmask]>
>>To: [log in to unmask] <[log in to unmask]>
>>Date: 18 May 1999 21:50
>>Subject: Re: [TN] Conductive Polymer
>>
>>
>>>I would be very interested in reading this paper. Could you possibly
>>compact
>>>it and send it via e-mail? Or would you send it to me at:
>>>
>>>Fred Shubert
>>>Kester Solder
>>>2105 60th. Ave. Dr. E.
>>>Bradenton, FL. 34203
>>>
>>>If that is not possible please let me know where I can obtain a copy.
>>>
>>>----- Original Message -----
>>>From: Jason Smith <[log in to unmask]>
>>>To: <[log in to unmask]>
>>>Sent: Tuesday, May 18, 1999 3:08 PM
>>>Subject: Re: [TN] Conductive Polymer
>>>
>>>
>>>> I wrote such a paper along those lines, but it's too big (due to
>>graphics)
>>>to
>>>> send over net.
>>>>
>>>>
>>>>
>>>> [log in to unmask] on 05/18/99 12:50:09 PM
>>>>
>>>> Please respond to [log in to unmask]; Please respond
>>to
>>>>       [log in to unmask]
>>>>
>>>> To:   [log in to unmask]
>>>> cc:    (bcc: Jason Smith/Lex/Lexmark)
>>>> Subject:  [TN] Conductive Polymer
>>>>
>>>>
>>>>
>>>>
>>>> Hi all,
>>>>
>>>> I am looking for commentary (pro and con) on conductive polymer as a
>>>> replacement for electroless copper. (not to be confused with carbon
based
>>>> technology i.e. Shadow, Black Hole etc.)
>>>>
>>>> More specifically I am looking for feedback on Uniplate. Reliability,
>>>> process robustness, general acceptance by assemblers/customers, I
>>>> appreciate all comments.
>>>>
>>>> Regards,
>>>> Dave Pizzoferrato
>>>>
>>>> ################################################################
>>>> TechNet E-Mail Forum provided as a free service by IPC using LISTSERV
>>1.8c
>>>> ################################################################
>>>> To subscribe/unsubscribe, send a message to [log in to unmask] with
>>>following text
>>>> in the body:
>>>> To subscribe:   SUBSCRIBE TechNet <your full name>
>>>> To unsubscribe:   SIGNOFF TechNet
>>>> ################################################################
>>>> Please visit IPC's web site (http://www.ipc.org) "On-Line Services"
>>>section for
>>>> additional information.
>>>> For technical support contact Hugo Scaramuzza at [log in to unmask] or
>>>847-509-9700
>>>> ext.312
>>>> ################################################################
>>>>
>>>> ################################################################
>>>> TechNet E-Mail Forum provided as a free service by IPC using LISTSERV
>>1.8c
>>>> ################################################################
>>>> To subscribe/unsubscribe, send a message to [log in to unmask] with
>>>following text in the body:
>>>> To subscribe:   SUBSCRIBE TechNet <your full name>
>>>> To unsubscribe:   SIGNOFF TechNet
>>>> ################################################################
>>>> Please visit IPC's web site (http://www.ipc.org) "On-Line Services"
>>>section for additional information.
>>>> For technical support contact Hugo Scaramuzza at [log in to unmask] or
>>>847-509-9700 ext.312
>>>> ################################################################
>>>>
>>>>
>>>
>>>################################################################
>>>TechNet E-Mail Forum provided as a free service by IPC using LISTSERV
1.8c
>>>################################################################
>>>To subscribe/unsubscribe, send a message to [log in to unmask] with
following
>>text in the body:
>>>To subscribe:   SUBSCRIBE TechNet <your full name>
>>>To unsubscribe:   SIGNOFF TechNet
>>>################################################################
>>>Please visit IPC's web site (http://www.ipc.org) "On-Line Services"
section
>>for additional information.
>>>For technical support contact Hugo Scaramuzza at [log in to unmask] or
>>847-509-9700 ext.312
>>>################################################################
>>>
>>
>>################################################################
>>TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
>>################################################################
>>To subscribe/unsubscribe, send a message to [log in to unmask] with
>following text in the body:
>>To subscribe:   SUBSCRIBE TechNet <your full name>
>>To unsubscribe:   SIGNOFF TechNet
>>################################################################
>>Please visit IPC's web site (http://www.ipc.org) "On-Line Services"
>section for additional information.
>>For technical support contact Hugo Scaramuzza at [log in to unmask] or
>847-509-9700 ext.312
>>################################################################
>>
>
>################################################################
>TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
>################################################################
>To subscribe/unsubscribe, send a message to [log in to unmask] with following
text in the body:
>To subscribe:   SUBSCRIBE TechNet <your full name>
>To unsubscribe:   SIGNOFF TechNet
>################################################################
>Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section
for additional information.
>For technical support contact Hugo Scaramuzza at [log in to unmask] or
847-509-9700 ext.312
>################################################################
>

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################

ATOM RSS1 RSS2