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May 1999

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Subject:
From:
"Fred S. Shubert" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 18 May 1999 16:48:30 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (93 lines)
I would be very interested in reading this paper. Could you possibly compact
it and send it via e-mail? Or would you send it to me at:

Fred Shubert
Kester Solder
2105 60th. Ave. Dr. E.
Bradenton, FL. 34203

If that is not possible please let me know where I can obtain a copy.

----- Original Message -----
From: Jason Smith <[log in to unmask]>
To: <[log in to unmask]>
Sent: Tuesday, May 18, 1999 3:08 PM
Subject: Re: [TN] Conductive Polymer


> I wrote such a paper along those lines, but it's too big (due to graphics)
to
> send over net.
>
>
>
> [log in to unmask] on 05/18/99 12:50:09 PM
>
> Please respond to [log in to unmask]; Please respond to
>       [log in to unmask]
>
> To:   [log in to unmask]
> cc:    (bcc: Jason Smith/Lex/Lexmark)
> Subject:  [TN] Conductive Polymer
>
>
>
>
> Hi all,
>
> I am looking for commentary (pro and con) on conductive polymer as a
> replacement for electroless copper. (not to be confused with carbon based
> technology i.e. Shadow, Black Hole etc.)
>
> More specifically I am looking for feedback on Uniplate. Reliability,
> process robustness, general acceptance by assemblers/customers, I
> appreciate all comments.
>
> Regards,
> Dave Pizzoferrato
>
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