TECHNET Archives

May 1999

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Copper grain size
From:
nishath yasmeen <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 18 May 1999 15:16:53 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (22 lines) 
Hello, I want to measure grain size of plated copper on wafers. I have a
few questions about this.
Our SEM lab tech says that copper has to be annealed for this. Is it
necessary? If it is why is it done? What is the recommended time and
temperature?
Does the thickness of the deposit make a difference?
I appreciate any suggestions.
Thanks
Yasmeen

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################

ATOM RSS1 RSS2