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May 1999

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Subject:
Re: Conductive Polymer
From:
Jason Smith <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 18 May 1999 15:08:55 -0400
Content-Type:
text/plain
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text/plain (56 lines) 
I wrote such a paper along those lines, but it's too big (due to graphics) to
send over net.



[log in to unmask] on 05/18/99 12:50:09 PM

Please respond to [log in to unmask]; Please respond to
      [log in to unmask]

To:   [log in to unmask]
cc:    (bcc: Jason Smith/Lex/Lexmark)
Subject:  [TN] Conductive Polymer




Hi all,

I am looking for commentary (pro and con) on conductive polymer as a
replacement for electroless copper. (not to be confused with carbon based
technology i.e. Shadow, Black Hole etc.)

More specifically I am looking for feedback on Uniplate. Reliability,
process robustness, general acceptance by assemblers/customers, I
appreciate all comments.

Regards,
Dave Pizzoferrato

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