Dave,
  IPC is working at IPC-7095 Design and Assembly Process Implementation
for BGAs - Chair, Ray Prasad, Prasad Consulting, may be you will find
your answer there when this doc were finished ( I don't known the date )
Jorge Dourado de Santana
Maintenance / Process Engr
Microtec - Brazil




> -----Original Message-----
> From: [log in to unmask] [SMTP:[log in to unmask]]
> Sent: 5 de Maio de 1999 14:32
> To:   [log in to unmask]
> Subject:      [TN] BGA soldering specs.
>
> Hi,
>
> I would like to know if IPC is going to publish BGA solder joint
> specifications
> for soldered BGA's.  My company
> is interested in what the IPC std. will be. We will be using X-ray to
> inspected
> the soldered joints after reflow.
> If IPC has some preliminary standards I would be interested in looking
> at them.
>
> Dave Burger
> Rockwell Automation
>
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