TECHNET Archives

May 1999

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
BGA soldering specs.
From:
[log in to unmask]
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 5 May 1999 13:31:51 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (23 lines) 
Hi,

I would like to know if IPC is going to publish BGA solder joint specifications
for soldered BGA's.  My company
is interested in what the IPC std. will be. We will be using X-ray to inspected
the soldered joints after reflow.
If IPC has some preliminary standards I would be interested in looking at them.

Dave Burger
Rockwell Automation

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################

ATOM RSS1 RSS2