Hello All,

We are conducting a Ball Attach process survey for reflowing 63/37 solder
balls onto BGA's using Water Soluble OA flux.  Four brief questions follow,
your input is greatly appreciated.

What production throughput is standard (strips/min. boats/min. or
trays/min.)?

What is the Time Above Liquidous (TAL), 183(superscript: o)C?

What is the preheat ramp rate, (superscript: o)C/s?

What is the delta T across the BGA (corner to center) at peak temperature?

Thanks in advance,

Shean R. Dalton
Product Manager
Speedline Accel
1825 East Plano Parkway
Plano, Texas 75074
[log in to unmask]
Ph. (972) 424-3525 ext. 118
Fx. (972) 424-7526

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