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May 1999

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Subject:
From:
Ed Cosper <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 13 May 1999 11:49:42 -0400
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text/plain
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Yes the oxide reduction process works well. It also in improved upon if you
bake after drill.  To test this theory Just drill a few panels with a solid
oxide core. Bake half then etch off the outside copper,  You will see a
significant difference.

Another popular approach being used in double treated and resin coated foil
which does not require a black oxide.

Ed Cosper


-----Original Message-----
From: [log in to unmask] <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Date: Thursday, May 06, 1999 1:24 PM
Subject: [TN] Black oxide process


>In producing multilayer PCB's, there is an oxide process used to prevent
pink
>ring.  Usually this process is called the "black oxide process" and
requires use
>of a reducer solution containing an amine borane.
>
>Is this process considered a standard in the PCB industry and is it's use
>increasing?
>
>Are there alternative processes which accomplish the same objective?
>
>What is the future trend to eliminate pink ring?
>
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