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May 1999

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Subject:
From:
Dan Gilpin <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 13 May 1999 08:17:51 -0400
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Hi Werner


Thanks for your feedback on rework reliability data.

FYI - John Goldak is a Professor at Carleton University in Ottawa, Canada
who is doing some FET development in solder joint thermal stress
reliability. His equations are unique in that they account for the
transient temperature gradient within the BGA package and relaxation creep.
He claims that the FET program will run on a Pentium II 400 MHz in less
than five hours. I suggest that you contact him directly at
[log in to unmask] for a more detailed explanation.


Dan Gilpin
Process Engineering
Mitel Corporation

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