Hello Technetters,

This is the IPC definition  Regarding solder ball acceptability, IPC-A-610B,

"Acceptability of Electronic Assemblies," section 4.1, states:

Nonconforming Defect - Class 1, 2, 3
Solder balls/splashes violate minimum electrical design clearance, or are
not encapsulated imbedded in a permanent coating or attached to a metal
contact.

Nonconforming Process Indicator - Class 1, 2, 3
Solder balls/splashes which are within 0.13 mm of lands or traces, or
exceed 0.13 mm in diameter.

More than 5 solder balls/splashes (0.13 mm or less) per 600 sq. mm.

Please explain the meaning of the above sentence.

Dose (0.13 mm or less) related to the Solder Balls diameter or 0.13 mm of
lands or
traces

Dose it mean that 5 solder balls/splashes that are bigger then 0.13 mm are
acceptable or it mean that 5 solder balls/splashes that are more then 0.13
mm of
lands or traces are acceptable.

Maybe we gut it all wrong please advice.

Best Regards
Chaim Krief

Process Engineer
Motorola South Israel Ltd.
16 Hakodhim St., Industrial Zone
P.O.B. 509 Arad 89104, Israel

Tel:  +972-7-9970344
Fax: +972-7-9970327
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