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May 1999

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Subject:
From:
"Stephen R. Gregory" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 10 May 1999 19:06:53 EDT
Content-Type:
text/plain
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In a message dated 5/10/99 3:17:40 PM Pacific Daylight Time, 
[log in to unmask] writes:

<< I need some leads on sources for ceramic boards.
 
 TIA
 
 Charlie Barker>>

Hello There Charlie!

Sent the ol' dawg out again (woof, woof!) and he's been sniffin' for ya' 
(gonna have ta get him some milkbones after today!..hehehe), he's found this:

Amitron, Incorporated
http://www.amitron.com
Telephone: (978) 686-1882
Fax: (978) 686-0622
Address: 85 Flagship Drive, North Andover, Massachusetts 01845

What is Amitron?
Amitron manufactures ceramic printed circuit boards and custom chip resistors 
utilizing Thick Film Technology. Our manufacturing capability includes 
multilayer circuitry, capacitor & resistor printing and fine line printing to 
3 mils & etching to 1.5 mils line width and spacing. With our ceramic 
machining capability, substrates can be configured to meet most geometrical 
requirements

Our capability for custom resistors provides values from milliohms to gigohms 
with sizes as small as .020" x .030". Chips can be provided with standard 
solder over nickel plating or with palladium silver, platinum gold, gold or 
silver terminations. Amitron chip attenuators have been tested and perform 
well at frequencies as high as 18 GHz.

SUBSTRATES
Standard substrate materials include alumina (Al2O3) in sizes to 6x4 inches 
and beryllia (BeO) in sizes to 3x3 inches.
Laser scribing .025" thick rectangular alumina provides the most effective 
approach to meeting mechanical requirements. When necessary, substrates can 
be machined or green punched to produce virtually any shape. Other available 
substrate materials include quartz, sapphire, ferrite and kapton. See Also: 
Laser Ceramic Machining
------------------------------------------------------------------------------
---
Here's another one that says they do ceramic PCB's...overseas company though, 
with corporate headquarters here in the states:

http://www.nationalcircuits.com

National Circuits Corporation
7898 East Acoma Drive #104
Scottsdale, Arizona 85260
(602) 948-2297
fax (602) 991-2112
email: [log in to unmask]
---------------------------------------------------------------------
Crown Circuits Inc.
High Quality, Time Critical, Proto Type PCB Manufacturer
6070 Avenida Encinas Carlsbad, California 92009 
Phone (760) 431-1124 - BBS (760) 431-1476 or (760) 431-2569
FAX (760) 431-1462

Capabilities and Turnaround times:
    a Double-sided boards in 24 hours
    Multilayer boards in 2 days (fully tested)
    Buried via boards in 3 days to 1 week
    (depending on the number of sequential laminations and drills)
    Electroless Au boards in 3 days.

Material categories:
    Standard FR4 material
    Teflon/Duroid
    Polyimide
    Ceramic substrates
    Heat sinks
    Getek

Special Processes:
    Impedance Control
    Soft gold plating
    Fine line width to .003
    Micro vias to .010
    Some heavy Cu boards with Vacuum Assist lamination
    Buried via technology
    Blind via technology
    Controlled depth drilling
    Conductive epoxy
    Differential impedance
--------------------------------------------------------------------
ARTEK inc.
http://www.artekinc.com
Phone 407-536-6229

ARTEK Electronics and Manufacturing Inc., and Superior Circuit Technologies, 
Inc., (Palm Bay, Florida,)
have formed a manufacturing and circuit packaging technology alliance. This 
strategic alliance brings
packaging design technology together with superior quality  prototyping, 
manufacturing, and rework
services for contract manufacturers, design firms, and Original Equipment 
Manufacturers.
For more information contact [log in to unmask] or [log in to unmask]

ARTEK has fifteen years of experience fabricating thick film substrates,
from the simplest project to the most complex multi-layer surface mount
electronic assembly. ARTEK adherence to strict quality standards means
that your product will meet all required commercial or military
specifications. Your budget won’t be wasted on costly reworks or returns.

Thick film fine line, multilayer and through hole processes
Fine Line geometries;
.002" lines and spaces 
Multilayers; Up to 15 layers with .002" vias 
Through hole diameters; .004" -.030" 
Thick film on alumina and BeO and Aln 
Resistor values; 0.1 ohm to1meg ohm 

Thin film photolithography
.002" lines and spaces 
TaN resistors 
Films on alumina and BeO 

Component Attachments
Au/Ge 
Au/Sn 
Au/Si 
Flip Chip 
Various solder alloys 
Various epoxies 

Wire bonding
Gold ball 
Gold wedge 
Aluminum wedge 
Ribbon 
Bonding on thick film, thin film,
COB,TAB, and COF


There's a few for ya' Charlie...hope this helps!

-Steve Gregory-
"...and his little mutt"

 

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