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Reply To: | TechNet E-Mail Forum. |
Date: | Thu, 13 May 1999 12:19:17 -0500 |
Content-Type: | text/plain |
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Hello All,
We are conducting a Ball Attach process survey for reflowing 63/37 solder
balls onto BGA's using Water Soluble OA flux. Four brief questions follow,
your input is greatly appreciated.
What production throughput is standard (strips/min. boats/min. or
trays/min.)?
What is the Time Above Liquidous (TAL), 183(superscript: o)C?
What is the preheat ramp rate, (superscript: o)C/s?
What is the delta T across the BGA (corner to center) at peak temperature?
Thanks in advance,
Shean R. Dalton
Product Manager
Speedline Accel
1825 East Plano Parkway
Plano, Texas 75074
[log in to unmask]
Ph. (972) 424-3525 ext. 118
Fx. (972) 424-7526
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