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May 1999

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TechNet <[log in to unmask]>
Subject:
BGA soldering specs.
From:
[log in to unmask]
Date:
Wed, 5 May 1999 13:31:51 -0400
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"TechNet E-Mail Forum." <[log in to unmask]>, [log in to unmask]
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text/plain (23 lines) 
Hi,

I would like to know if IPC is going to publish BGA solder joint specifications
for soldered BGA's.  My company
is interested in what the IPC std. will be. We will be using X-ray to inspected
the soldered joints after reflow.
If IPC has some preliminary standards I would be interested in looking at them.

Dave Burger
Rockwell Automation

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