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April 1999

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Subject:
From:
Jeff Hempton <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 8 Apr 1999 10:18:06 -0400
Content-Type:
text/plain
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text/plain (65 lines)
Chris,
  Yes, you can but SAW die directly. We were building hybrids with these die
years ago for delay line applications, but that is the only experience I have,
and this was on ceramic. But yes, you should be able to bond them onto a PCB.
SAW die are typically long and thin, but do not buy any longer then the
application requires, since the longer they are, the more susceptible to "die
fracturing while handling".  One of the challenges, is to keep them from
"vibrating" when powered-up. A trick we used that was very effective, was to
attach die with RTV (Dow Corning 3140), and also, place a small dot of RTV at
the end of each device. This "damped" the oscillation of the part. After
wirebond you could then coat the device with RTV as your COB sealer (we used
hermetically sealed cans), if your end process allows. If not, you will need to
test a few vendors globtop with your devices & RTV to insure compatibility,
etc., just like any new process. Thumbs-up! Good Luck!
Jeff Hempton
United Technologies Electronic Controls

______________________________ Forward Header __________________________________
Subject: [TN] Application of SAW filter chips
Author:  Chris Flores <[log in to unmask]> at Internet
Date:    4/8/1999 8:04 AM


This might sound slightly off-the-wall but I have to ask the question:

Is it possible to buy SAW filter chips without the package (probably YES)

Is it possible to bond them directly onto a PCB and then to glob-top them?
And how would the globtop affect the performance of the device?  Or is a glob
really needed?  Anything special needed for the chip-attach to the board?

I would really appreciate any information members might have, as I am very
much out of my depth with this type of device!

Chris Flores

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