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April 1999

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Subject:
From:
Ryan Chase <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 8 Apr 1999 09:37:47 MDT
Content-Type:
text/plain
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text/plain (106 lines)
I basically run the glue through the oven at the same temperature
profile as reflow.  I just knocked down the zones (5 in all) a few
degrees each.  So far I have not had any problems (that I know of,
sometime the operators forget to fill out the inspection sheets so I
am not always aware that there are problems).

We run the glue side then flip the PCB's and run the paste side.  So
far no parts have fallen off, except for a couple of times when the
PCB's were run across the edge of a desk by accident (don't ask
why) but otherwise they stay in place.

I am running AIM glue and paste in a no clean operation.

Hope this helps.

Ryan

Date sent:              Wed, 7 Apr 1999 14:28:04 -0400
Send reply to:          "TechNet E-Mail Forum." <[log in to unmask]>,
                "Tempea, Ioan" <[log in to unmask]>
From:                   "Tempea, Ioan" <[log in to unmask]>
Subject:                Re: [TN] Can adhesive go thru reflow soldering?
To:                     [log in to unmask]

> Davis,
>
> I made some tests as follows: I used adhesive and solder paste for the
> components on the solder side of double sided assemblies.
> So, after printing the solder cream the adhesive has been dispensed.
> Naturally, the board is reflowed, with the adhesive uncured, the curing
> occurs at a certain stage of the reflowing.
> Of course, the curing temperature of the glue is about 150C and the
> reflowing cycle was exposing the board to 280C.
> I couldn't find any problem with the adhesive after waving the boards, so
> the glue didn't crack during the exposure to 280C or the tensions during the
> wave soldering.
>
> So the 150C for 90-120 sec is simply the curing cycle, but after curing the
> adhesive can suffer reflow and waving. I'm pretty sure of that.
>
> Regards,  Ioan
>
> > -----Original Message-----
> > From: Davis Yang [SMTP:[log in to unmask]]
> > Sent: Wednesday, April 07, 1999 12:06 AM
> > To:   [log in to unmask]
> > Subject:      [TN] Can adhesive go thru reflow soldering?
> >
> > Dear Sir,
> >     We have to put adhesive(glue) on PCBA before reflow.  the adhesive
> > we are using is LOCTITE 3609. but the spec for the adhesive is 150C
> > degree with 90 - 120 Seconds. We want to know if any issue for the
> > adhesive to go thru reflow profile? we are worrying about potential
> > reliability problem. and the supplier can't give us the answer.
> > please give any  advice on the question.
> > thanks a lot!
> > Davis
> >
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-----------------------
Ryan Chase
Manufacturing Engineer
GE Harris
403-214-4502
Fax 403-287-3107
[log in to unmask]

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