> We have recently completed a prototype build of a board with a variety
> of BGA styles on (PBGA196, PBGA119, PBGA256, PBGA357.) We have
> experienced a functional failure rate of 80% attributable to the one
> PBGA357 on each PCB, no such problems  were evident on the other BGAs.
> X-ray analysis has not revealed any blatant errors (shorts, missing
> balls etc.) nor were there any obviously poor contact solder joints,
> except in one instance where possible non-wetting at the edge of some
> lands was just visible.
>
> I'd be interested to hear from anyone who has experience with large
> size BGAs who can suggest means to identify cause of failure and any
> necessary assembly process adjustments we should make. Our equipment
> list is Dek260AF printer, Philips CSM Eclipse CE1 pick&place,
> Conceptronics HVA60 reflow oven.
>
> Thanks
>
> Nigel Burtt
> Production Engineering Manager
> D - European HQ
> Email: [log in to unmask]
> Tel:     01793 842132
> Fax:    01793 842101
>

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