Davis,

   Once in the paste ( 5 years ago ) we use the same glue and cured at
solder reflow profile. Our intention was keep 0603 components in place
during reflow to avoid " tombstoning ", at that time we had a bad 0603
pad design and a lot of rejections due tombstoning, and we use glue
until new 0603 pad design were aproved.No problem were found that time
related with glue.

Thanks
Jorge Santana
Process Engr
Microtec - Brazil


> -----Original Message-----
> From: Davis Yang [SMTP:[log in to unmask]]
> Sent: 7 de Abril de 1999 01:06
> To:   [log in to unmask]
> Subject:      [TN] Can adhesive go thru reflow soldering?
>
> Dear Sir,
>     We have to put adhesive(glue) on PCBA before reflow.  the adhesive
> we are using is LOCTITE 3609. but the spec for the adhesive is 150C
> degree with 90 - 120 Seconds. We want to know if any issue for the
> adhesive to go thru reflow profile? we are worrying about potential
> reliability problem. and the supplier can't give us the answer.
> please give any  advice on the question.
> thanks a lot!
> Davis
>
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