Davis

We cure glue at 150C for approx 100 seconds. Then the glue goes through
a standard reflow profile.

We don't appear to have any problems with the glue and all the
components stay where there meant to.
Although to be fair we don't carry out any pull tests on the glued
components.
So I can't say for definite if the glue is effected by the second reflow
stage..

The glue is Hereaus (PY955) which is screened on.

Good luck

Stephen Bonaccorsi

> ----------
> From:         Davis Yang[SMTP:[log in to unmask]]
> Reply To:     [log in to unmask]
> Sent:         Wednesday 07 April 1999 05:05
> To:   [log in to unmask]
> Subject:      [TN] Can adhesive go thru reflow soldering?
>
> Dear Sir,
>     We have to put adhesive(glue) on PCBA before reflow.  the adhesive
> we are using is LOCTITE 3609. but the spec for the adhesive is 150C
> degree with 90 - 120 Seconds. We want to know if any issue for the
> adhesive to go thru reflow profile? we are worrying about potential
> reliability problem. and the supplier can't give us the answer.
> please give any  advice on the question.
> thanks a lot!
> Davis
>
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