Pitting is a process problem and is not workmanship defect like as solder
mask skipping.  Carbon treatment is the conventional way to resolve the
pitting problem. However, you must find the root cause where the organic
come come and how it accumulate?

____________________________________________________________


At 04:19 AM 1999/4/6 +0200, Smith Russell MSM LAPO US wrote:
>With reference to Air in the Solution , an overlooked area is the
>circulation systems. Make sure that the suction side of the pump has no
>leaks, and for best results put the filtration on the pressure side of
>the pump. this way you can eliminate cavitation of the impeller by
>providing a constant back pressure on the impeller. Also don't forget to
>pre-wet your filters to remove most of the air from them before you
>install them.
>        With todays fine feature technology I don't recommend increasing
>the filter rating  much beyond 50 micron absolute .
> ----------
>From: Gwerder Lorenz
>To: [log in to unmask]
>Subject: [TN] Pitting
>Date: Saturday, April 03, 1999 3:07AM
>
>We are a PCB manufacturer and are currently dealing with the "PITTING"
>problem. Small holes, craters in the electrolitic copper.
>Is there any acceptability guideline corresponding this problem. I did
>not find it in the IPC-A-600.
>
>
>Thanks for your help
>
>
>Lorenz Gwerder
>
>
>[log in to unmask] <mailto:[log in to unmask]>
>www.photochemie.ch <http://www.photochemie.ch>
>
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>Attachment Converted: "c:\eudora1\attach\Re [TN] Pitting"
>

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