Subject: | |
From: | |
Reply To: | TechNet E-Mail Forum. |
Date: | Wed, 7 Apr 1999 11:03:27 +0800 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Dear Technetters,
Calling all you experts out there, can anyone tell me in which area of
the BGA/CSP assembly process does manufacturers experience
defects/faults.What are the common faults which BGA manufacturers
concerns?
Thank you all for your kind attention.
example of a BGA assembly process:
1)substrate__2)die-attach__3)wirebonding__4)encapsulation__5)marking__
6)singulation__7)flux-print__8)ballplacement__9)reflow/ballattach__10)
cleaning__11)packaging.
Best Regards,
Lawrence Yeo
################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe: SUBSCRIBE TechNet <your full name>
To unsubscribe: SIGNOFF TechNet
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################
|
|
|