Ed:  Your anxieties about the reliability of the connections you describe are
well founded.  IMHO about the only chance for survival the circuits have, and
a slim one at that, is if the components (ceramic is assumed) are mounted to
a ceramic/alumina board (to negate or minimize Tce between component and
board). It would also aid reliability if the components have good standoff
above the board (>0.005 inch) so that sufficient solder pedestal exists to
provide some compliance.  I am away from my office (in snowy Colorado) and
consequently don't have access to my files so am unable to reference you
directly to the appropriate technical information.  You might review any work
by Manko, Zaro, etc., or wait for an input from Werner.  Tread cautiously,
and make sure the method and results of any ESS are heeded.
Jim Moffitt

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