The following is the definition in IPC-4104 for microvia.
3.1.1 Microvia (Build-Up Via) Blind and buried vias that are less than or equal to
0.15 mm and have pad diameters that are less than or equal to 0.35 mm.
IPC-4104 should be published within the next 60 days and this term has been provided
to the IPC-T-50 task group for inclusion in IPC-T-50 as a standard industry term.
Best,
Chris
Chris Jorgensen
Project Manager
IPC
2215 Sanders Rd
Northbrook, IL 60062
847-790-5328
Get the Lead Out at IPCWorks '99
October 23-28, 1999
Minneapolis Convention Center
Minneapolis, MN
>>> Brian McDermott <[log in to unmask]> 04/06/99 02:50PM >>>
Harvey,
The industry tends to distinguish microvias by their
size rather than the method of manufacture.
6 mils (or 150um) is the generally accepted transition
point to a microvia.
Whether the via is formed by mechanical drilling, by
laser drilling or photo defined, it is still a microvia.
I prefer the term HDI (High Density Interconnect) to
describe this technology which includes smaller vias,
finer lines, smaller SMT pads, smaller pitch etc.
Please contact me if you need any more info.
Regards,
Brian McDermott
Director of Advanced Technology
MicroVia, Inc.
Winter Springs FL 32708 USA
Website : www.microvia.com
e-mail : [log in to unmask]
Voice (407)6995000x214 Fax 6996871
------------------------------------------------
-----Original Message-----
From: Harvey Monroe PHILLIPS <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Date: Monday, April 05, 1999 11:30 PM
Subject: [TN] Definition of Microvias
>Dear TechNetters,
>
>I have a question about the usage of the term "microvia". Does it refer
>specifically to vias (either blind or through) in a build-up layer or does
>it refer primarily to the size of the via (say blind or through vias with
>diameters less than 150 microns)?
>
>Thanks,
>Harvey Phillips
>
>Research Fellow
>Microelectronic Materials and Packaging Group
>INSTITUTE OF MATERIALS RESEARCH AND ENGINEERING
>TEL: (+65) 872 7545
>FAX: (+65) 872 7528, (+65) 872 0785
>e-mail: [log in to unmask] <mailto:[log in to unmask]>
>
>Block S7, Level 3
>National University of Singapore
>Singapore 119260
>
>################################################################
>TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
>################################################################
>To subscribe/unsubscribe, send a message to [log in to unmask] with following
text in the body:
>To subscribe: SUBSCRIBE TechNet <your full name>
>To unsubscribe: SIGNOFF TechNet
>################################################################
>Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section
for additional information.
>For technical support contact Hugo Scaramuzza at [log in to unmask] or
847-509-9700 ext.312
>################################################################
>
################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe: SUBSCRIBE TechNet <your full name>
To unsubscribe: SIGNOFF TechNet
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for
additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700
ext.312
################################################################
################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe: SUBSCRIBE TechNet <your full name>
To unsubscribe: SIGNOFF TechNet
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################
|
