TECHNET Archives

April 1999

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
"Lustig, Steven K.." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 29 Apr 1999 16:38:16 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (39 lines)
TechNetters,

I would appreciate your help in deciphering a defect we are seeing
across one board after reflow.

The larger solder joints are exhibiting a ring-like structure - there
are a couple of lines in the joint ringed around the part (as if it
cooled at different rates depending on how close the solder was to the
part?).

Also, all of the parts (large and small) have many black "splotches" on
the joints.  Some of them, if you look closely, appear like snowflakes
or leaves of a fern tree.

Any ideas on the cause and suggestions to fix this?

Thanks.

-Steven

Steven K. Lustig
Process Engineer
EMS Technologies, Inc.
Norcross, GA
(770) 263-9200 x4714
[log in to unmask]

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################


ATOM RSS1 RSS2