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April 1999

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Subject:
From:
Albert Mok <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 29 Apr 1999 09:25:42 +0800
Content-Type:
text/plain
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text/plain (137 lines)
Dear Art,

You are completely right.  However, immersion gold and electroplated gold
give different story.  Thick gold from immersion gold process has the worse
effect for solderability.

____________________________________________________________

At 07:48 AM 1999/4/28 -0500, Art Fisher wrote:
>You might want to add a little about gold plating.  Gold in itself does
>NOT bond to solder.  It does, however, protect against oxidation.  The
>gold plating has to be very thin, on the order of 2 - 3 micros.  The
>solder actually goes through the gold to bond to the surface underneath.
>If the gold layer is too thick, the components will just fall off.  We
>had a board house plate the pads with a thicker layer used with edge
>connectors, and most of the components just fell off.  You have to be
>very careful with the process.
>Art
>
>> -----Original Message-----
>> From:        Albert Mok [SMTP:[log in to unmask]]
>> Sent:        Wednesday, April 28, 1999 7:40 AM
>> To:  [log in to unmask]
>> Subject:     Re: [TN] Flash Gold??
>>
>> Dear technetters,
>>
>> We regard "flash gold"for gold thickness up to 2 microinch.  The
>> purpose of
>> gold flash is to give protection of nickel against oxidation and also
>> provide better solderability when compared with bare nickel.  Flasg
>> gold is
>> very common for COB boards and the whole board will be electroplated
>> for
>> maximum 2 microinch.
>>
>> _____________________________________________________________
>>
>>
>> At 06:58 AM 1999/4/27 -0700, David McCann wrote:
>> >We have used flash gold on rigid flex products to maintain a
>> solderable
>> >surface.  Typically I have seen approximately 4 microinches of Au (ie
>> flash
>> >Au referring to a very thin electroless plating), over 100
>> microinches
>> >minimum of electroless Ni over Cu.
>> >
>> >Regards,
>> >
>> >-----Original Message-----
>> >From: TechNet [mailto:[log in to unmask]]On Behalf Of Nick Liang
>> >Sent: Monday, April 26, 1999 11:41 PM
>> >To: [log in to unmask]
>> >Subject: [TN] Flash Gold??
>> >
>> >
>> >All:
>> >What is Flash Gold Process??
>> >
>> >Thanks for your answers.
>> >
>> >-----------------------------------------------
>> >Nick Liang
>> >QE Engineer
>> >Quality Assurance Division
>> >Gold Circuit Electronics Ltd.
>> >Tel : (886) 03-4612541 Ext 417
>> >Fax: (886) 03-4522094
>> >Cell: (886) 0935-917151
>> >E-Mail : [log in to unmask]
>> >------------------------------------------------
>> >
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>

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