Hello Ladies and Gentlemen,

This is Tom Martling at Pentex-Schweizer Circuits.
I have been searching for any data concerning intermetallic growth during
thermal cycles. Of course this is all related to solderability issues.
I am searching for this data to determine which would lead to better
solderability.  I am trying to find a relationship between SnPb thickness
and solderability  (a familiar question) .
Is there any statistical data which suggests 50 microinches of SnPb is
better than 25 microinches in solderability performance ?
Question: during thermal excursions, would there be more growth of
intermetallic if the plating thickness was 50 uin. ?   25 uin. ?   and how
does it effect solderability.

If anyone can find a chart or a report on this subject (including effects
of thermal cycling) I would be very appreciative.

Thanks for taking the time.
Regards
Tom Martling
Customer service/ Tech support
Pentex-Schweizer Circuits

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