The vias are usually filled during the wave process.  However, the board
house can fill them during manufacture of the board.  18 - 19 mils is a
standard size for vias.  If they are to carry high current, perhaps
larger vias may be in order.

> -----Original Message-----
> From: Ken Patel [SMTP:[log in to unmask]]
> Sent: Wednesday, April 28, 1999 7:39 AM
> To:   [log in to unmask]
> Subject:      [TN] How to fill Vias? ...
>
> I am in dilemma. We have designed a board which require double reflow
> process with selective wave operation. Here is the problem - How can I
> get
> vias filled  solder which will carry 1 amp current. Some vias are
> underneath
> the components and many are away from the selective wave fixture
> opening.
>
> Finished hole size of the via is 18 mils. Can fab house fill the vias?
>
> re,
> Ken Patel
> ______________________________________________________
> Ken Patel                       Phone:  (408) 490-6804
> 1708 McCarthy Blvd.             Fax:    (408) 490-6859
> Milpitas, CA 95035              Beeper: (888) 769-1808
>
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