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April 1999

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Subject:
Soldering to Brass
From:
"Severson, Scott M." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 28 Apr 1999 07:29:19 -0500
Content-Type:
text/plain
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text/plain (1 lines) 
 Hi All,

 

I understand that the zinc in the brass will migrate into the Sn/Pb

solder and cause defective joints and quite possibly a latent defect.  

 

I've also read that if a solder alloy contains too much zinc it can

produce dull joints and also increase surface oxidation of the molten

metal and possibly affect wetting characteristics of the solder.

 

My question is:  How does the zinc react with the tin and what is the

mechanism that comes into play for joint failure.

 

Thanks

Scott

 

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Scott M. Severson                      

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