Dear technetters,

We regard "flash gold"for gold thickness up to 2 microinch.  The purpose of
gold flash is to give protection of nickel against oxidation and also
provide better solderability when compared with bare nickel.  Flasg gold is
very common for COB boards and the whole board will be electroplated for
maximum 2 microinch.

_____________________________________________________________


At 06:58 AM 1999/4/27 -0700, David McCann wrote:
>We have used flash gold on rigid flex products to maintain a solderable
>surface.  Typically I have seen approximately 4 microinches of Au (ie flash
>Au referring to a very thin electroless plating), over 100 microinches
>minimum of electroless Ni over Cu.
>
>Regards,
>
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]]On Behalf Of Nick Liang
>Sent: Monday, April 26, 1999 11:41 PM
>To: [log in to unmask]
>Subject: [TN] Flash Gold??
>
>
>All:
>What is Flash Gold Process??
>
>Thanks for your answers.
>
>-----------------------------------------------
>Nick Liang
>QE Engineer
>Quality Assurance Division
>Gold Circuit Electronics Ltd.
>Tel : (886) 03-4612541 Ext 417
>Fax: (886) 03-4522094
>Cell: (886) 0935-917151
>E-Mail : [log in to unmask]
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