I would like to echo Nick's question, and add to it if I may:
     What diameter vias are you using out there? We recently used .026" on
     a surface-mount-both sides (reflow/reflow) product that has a ton of
     via's, and the PWB vendor did a 2nd fill with an LPI solder mask
     (tented via), but the fill was too tall for us to print the solder
     paste on the rear side of the board (BIG PROBLEM-O, CAN YOU SAY
     NON-CONTACT PRINTING?) We have discussed going to .018" diameter vias
     to aid in tenting with one pass with the LPI soldermask....any
     suggestions out there, please???


______________________________ Forward Header __________________________________
Subject: [TN] Solder filled vias
Author:  Nick Nicolaides <[log in to unmask]> at Internet
Date:    4/5/1999 5:16 PM


        Recently one of our PCB houses has shipped boards with the VIAS
filled with
        solder. Generally per IPC600, it states that VIAS other than blind
or buried
        can be solder masked or solder (coated). Since this area is quiet in
the IPC
        or J-Standards, what is your take on this. In addition on the same
boards we
        see both solder mask and solder filled.

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text
in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for
additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700
ext.312
################################################################

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################