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April 1999

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Subject:
Re: Traces
From:
"Edwards, Ted A (AZ75)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 27 Apr 1999 15:34:47 -0700
Content-Type:
text/plain
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text/plain (72 lines) 
Suggest you look at the archives of the TechNet on the IPC WEB site
http:\\www.ipc.org and look under interconnect post separation, post
separation and interconnect failure categories.

> -----Original Message-----
> From: Art Fisher [SMTP:[log in to unmask]]
> Sent: Tuesday, April 27, 1999 3:00 PM
> To:   [log in to unmask]
> Subject:      Re: [TN] Traces
>
> Thank you all for your responses.  Checking further, the area in question
> was waved, so hand soldering heating should be eliminated.  If a board
> faults going through wave, then something is wrong with the board house.
> I
> am having the board cross sectioned, and need to get on top of this
> quickly.
> The board is used as the guts of a defibrillator.
>
> > -----Original Message-----
> > From: [log in to unmask] [SMTP:[log in to unmask]]
> > Sent: Tuesday, April 27, 1999 4:32 PM
> > To:   [log in to unmask]
> > Subject:      Re: [TN] Traces
> >
> > Inner layers separate from hole wall plating for various reasons, but
> > overheating during hand soldering is a definite possibility.
> >
> > Susan Mansilla
> > Technical Director
> > Robisan Lab
> >
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