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April 1999

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Subject:
From:
Jim Marsico 516-595-5879 <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 26 Apr 1999 07:29:00 -0500
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TEXT/PLAIN (27 lines)
Helloooo Technet:

I hope everybody had a nice weekend...

We've been attempting to solder a surface mount capacitor with limited success,
the metallization dissolves away.  It turns out that the terminations are 300
microinches of Platinum/Gold covered with 15 microinches of gold.  Is this type
of finish suitable for soldering? (hand or reflow?)  How would the reliability
compare with a more standard finish like a nickel barrier layer followed by
gold?

Thanks in advance,

Jim Marsico

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