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April 1999

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Subject:
From:
Andy Slade <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 26 Apr 1999 07:34:35 -0400
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     Our experience has been that the solvent swell in a permanganate
     desmear system tends to go after the CB-100 a bit too much.  It will
     swell out causing positive bumps on the surface of the board.  I'm
     sure we could have adjusted dwell, or otherwise worked through the
     problem, but since we have plasma available, that seemed like the most
     expedient solution.

     Andy


______________________________ Reply Separator _________________________________
Subject: Re: [TN] Blind Via Adhesion
Author:  Lourdes Mertens <[log in to unmask]> at smtplink-hadco
Date:    04/25/99 5:53 AM


Andy,
When using CB-100,  why do you prefer plasma  at desmear process?

Lourdes

>>> Andy Slade <[log in to unmask]> 04/23 5:08 AM >>>
     Hi Mike,

     The only way we were able to get this under control was to do a flash
     plate immediately after electroless copper dep.  I am assuming that
     you are taking the panels through a permanganate desmear, prior to
     dep.  If you are using plasma alone, this does not provide enough
     surface topography.

     Another option, but it's a costly one, is to pre-fill the vias with
     something like DuPont CB-100.  This accepts metalization better than
     pure resin.  Need to use caution at desmear - must use plasma only.

     Hope this helps...Andy


______________________________ Reply Separator _________________________________
Subject: [TN] Blind Via Adhesion
Author:  Mike Bailey <[log in to unmask]> at smtplink-hadco
Date:    04/22/99 9:01 AM


Got an age old problem.  Maybe there are some new solutions.  We're building
some conventional sub-assy blind via boards that have via in pad
configurations.  No big surprise, the electroless copper adhesion on the
resin-fill areas is blistering.  Re-design using laser drilling is not an
option, nor is direct plate technology or plasma.  We have tried the usual
pre-electroless copper bake as well as post-bake, mechanical scrubbing etc.
etc.  I'm a little hesitant to play with additional desmear tactics as they
have a tendency to or smooth out the original surface texture.

Also as usual, I don't have much time.

Material is conventional 140 Tg epoxy
Hole dia. is .0118.
Yes, some surface sanding is required after final lamination (just like the
rest of you guys)!!

Any ideas?

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