Hi Bob,
You may want to look at Engelmaier, W., "BGA and CGA Solder Attachments: 
Results of Low-Acceleration Test and Analysis," Proc. Surface Mount 
International Conf., San Jose, CA, August 1995, pp. 344-358; also in Proc. 
Int. Electronics Packaging Conf. (IEPS), San Diego, September 1995, pp. 
758-774; also in Proc. 1995 Japan Int. Electronic Manufacturing Technology 
Sympf. (IEMT), Omiya, Japan, December 1995, pp. 218-227; also in Proc. NEPCON 
West ‘96, Anaheim, CA, February 1996, pp. 1020-1036; also in Proc. Printed 
Circuit World Convention VII, Basel, Switzerland, May 1996, pp. P14/i-P14/14; 
also in Soldering & Surface Mount Technology, No. 24, October 1996, pp. 
25-31; and Engelmaier, W., "Design for Reliability: Solder Attachments for 
BGAs and CGAs," Proc. IPC Ball Grid Array National Symp., San Diego, CA, 
January 1996. You should also look for the papers on the subject by Andrew 
Mawer, Motorola.

Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL  32174  USA
Phone: 904-437-8747, Fax: 904-437-8737
E-mail: [log in to unmask]  

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