Hi Albert,

We have a unique method of characterizing copper thickness changes due to
microetch.  Precision resistance measurements from specialized patterns
provide copper thickness directly.  Please contact me off line for more
information.

Best Regards,

Ronald J. Rhodes
President
Conductor Analysis Technologies, Inc.
Phone: 732-424-1919
Fax: 732-424-1886
Email: [log in to unmask]
Web: http://biz.swcp.com/cat


-----Original Message-----
From:   TechNet [mailto:[log in to unmask]] On Behalf Of Albert Mok
Sent:   Thursday, April 22, 1999 1:40 AM
To:     [log in to unmask]
Subject:        [TN] Microetch depth measurement

Dear technetters, good morning,

Many board shops required microetch process, which is normal the
pretreatment/pre-cleaning of copper surface prior to subsequent chemical
processes. We have to control the etch depth, either from the spray system,
or the batch wise bath from autoplating line.  The desired etch depth
varies from process for process but ranging from 20-50 microinch.

We are using one sq. ft. bare board for the etch testing so that the etch
depth is calculated when we based on the fact that 1 microinch is 0.02g of
copper for one side.

We hope to collect ideas or  to gain your experience for getting this
results more wisely.  We tried of weighing the board, etch, clean and weigh
it again.  We are thinking to make some tools for this test so as to make
the control more easily. We hope to plate copper at a control thickness of
30 microinch and use this as a specimen for the control test or to find a
way telling the etch depth by co-relation.  We cannot consider the etch
chemicals condition since the batch wise and spray application are two
extremes.

Please kindly offer your ideas and chat.

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